Joining Challenges in the Packaging of BioMEMS

H.J. Herfurth*, R. Witte*, S. Heinemann*, G. Newaz**, A. Mian**, D. Georgiev**, G. Auner* *

*Fraunhofer Center for Laser Technology CLT, 46025 Port Street, Plymouth, MI, USA

**Wayne State University, College of Engineering, Detroit, Michigan, USA

Abstract: 

Micro-joining and hermetic sealing of dissimilar and biocompatible materials is a critical issue for a broad spectrum of products such as micro-electronical, micro-optical and biomedical products and devices. Novel implantable microsystems currently under development will include functions such as localized sensing of temperature and pressure, electrical stimulation of neural tissue and the delivery of drugs. These devices are designed to be long-term implants that are remotely powered and controlled. The development of new, biocompatible materials and manufacturing processes that ensure long-lasting functionality and reliability are critical challenges. Important factors in the assembly of such systems are the small size of the features, the heat sensitivity of integrated electronics and media, the precision alignment required to hold small tolerances, and the type of materials and material combinations to be hermetically sealed.  Laser micromachining has emerged as a compelling solution to address these manufacturing challenges. This paper will describe the latest achievements in microjoining of non-metallic materials. The focus is on glass, metal and polymers that have been joined using CO2, Nd:YAG and diode lasers. Results in joining similar and dissimilar materials in different joint configurations are presented, as well as requirements for sample preparation and fixturing. The potential for applications in the biomedical sector will be demonstrated.